JPS6317229B2 - - Google Patents
Info
- Publication number
- JPS6317229B2 JPS6317229B2 JP55041750A JP4175080A JPS6317229B2 JP S6317229 B2 JPS6317229 B2 JP S6317229B2 JP 55041750 A JP55041750 A JP 55041750A JP 4175080 A JP4175080 A JP 4175080A JP S6317229 B2 JPS6317229 B2 JP S6317229B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrodes
- electrode
- polysilicon
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0198—Integrating together multiple components covered by H10D44/00, e.g. integrating charge coupled devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4175080A JPS56138951A (en) | 1980-03-31 | 1980-03-31 | Manufacture of semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4175080A JPS56138951A (en) | 1980-03-31 | 1980-03-31 | Manufacture of semiconductor memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56138951A JPS56138951A (en) | 1981-10-29 |
JPS6317229B2 true JPS6317229B2 (en]) | 1988-04-13 |
Family
ID=12617090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4175080A Granted JPS56138951A (en) | 1980-03-31 | 1980-03-31 | Manufacture of semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56138951A (en]) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6378960A (ja) * | 1986-09-22 | 1988-04-09 | 日本ゼオン株式会社 | 防音床材 |
JPS6378961A (ja) * | 1986-09-22 | 1988-04-09 | 日本ゼオン株式会社 | 制振複合床材 |
JPH0272733U (en]) * | 1988-11-25 | 1990-06-04 | ||
JPH02105438U (en]) * | 1989-02-10 | 1990-08-22 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5275190A (en) * | 1975-12-18 | 1977-06-23 | Toshiba Corp | Production of 4-phase drive charge coupling device |
US4097885A (en) * | 1976-10-15 | 1978-06-27 | Fairchild Camera And Instrument Corp. | Compact, two-phase charge-coupled-device structure utilizing multiple layers of conductive material |
-
1980
- 1980-03-31 JP JP4175080A patent/JPS56138951A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6378960A (ja) * | 1986-09-22 | 1988-04-09 | 日本ゼオン株式会社 | 防音床材 |
JPS6378961A (ja) * | 1986-09-22 | 1988-04-09 | 日本ゼオン株式会社 | 制振複合床材 |
JPH0272733U (en]) * | 1988-11-25 | 1990-06-04 | ||
JPH02105438U (en]) * | 1989-02-10 | 1990-08-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS56138951A (en) | 1981-10-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2647034B2 (ja) | 電荷結合素子の製造方法 | |
JPS60234372A (ja) | 半導体装置の製造方法 | |
JPS6317229B2 (en]) | ||
JP2870086B2 (ja) | Mos型不揮発性半導体記憶装置の製造方法 | |
JPS6315749B2 (en]) | ||
JPH07176714A (ja) | 半導体装置の製造方法 | |
JP3061822B2 (ja) | 固体撮像素子およびその製造方法 | |
JP3321613B2 (ja) | シリコン基板中への浅溝・深溝形成方法 | |
JPH04208572A (ja) | 半導体記憶装置の製造方法 | |
JPS5933271B2 (ja) | 半導体装置の製造方法 | |
JP2867469B2 (ja) | 電荷転送装置及びその製造方法 | |
JP2603088B2 (ja) | 半導体装置 | |
JP2950620B2 (ja) | 半導体装置 | |
JPH07326660A (ja) | 半導体装置の製造方法 | |
JPH06196497A (ja) | 半導体装置の製造方法 | |
JPH03136348A (ja) | 不揮発性メモリ素子の製造方法 | |
JPS63122239A (ja) | 半導体装置の製造方法 | |
JPH0474477A (ja) | 不揮発性記憶装置およびその製造方法 | |
TWI242238B (en) | Manufacturing method for dual gate oxide layer | |
JP2623647B2 (ja) | 半導体装置の製造方法 | |
JPH0230160A (ja) | 半導体装置 | |
JPH0831597B2 (ja) | 絶縁ゲート電界効果形半導体装置の製造方法 | |
JPH06252411A (ja) | 半導体記憶装置の製造方法 | |
JPH0793367B2 (ja) | 半導体記憶装置およびその製造方法 | |
JPH06177119A (ja) | 半導体装置の製造方法 |